Topics

Topics to be covered in the Electronic Materials and Packaging in Space Symposium include:

  • Printed Circuit Boards
  • Electronic Assembly
  • EEE Packaging
  • System-In-Package
  • Digitalisation
  • High Density Interconnect
  • Lead-free assembly

Topics covered in Training Course on PCB and Electronic Assembly are:

  • PCB design and manufacture
  • PCB procurement and supply chain
  • PCB qualification
  • EA verification
  • EA sensitive devices
  • Materials & Processes Control Board
  • Mission classification and COTS
  • Failures and nonconformances
  • Technology development


      ESA Conference Bureau / ATPI Corporate Events

      ESA-ESTEC, Keplerlaan 1
      2201 AZ Noordwijk, The Netherlands

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