The aim of the Workshop is to promote and facilitate discussion and exchange of experience and information among members of the various disciplines related to Space components packaging & reliability and the associated materials and processes.

Topics 
Authors are encouraged to submit papers on topics they consider relevant. For instance but not limited to: 

• Optoelectronics packaging
• COTS for flight applications
• SiP: System in Package, Chip Scale packaging (CSP)
• 2.5D, 3D packaging & Integration
• Wafer level packaging, Fan-out packages Through-silicon-via
• Flip-chip assembly
• Technologies and materials for High power packages
• Non-hermetic packages for Space applications
• High density packages
• Wire bonding for high density packages

We would like to encourage you to submit an abstract on a relevant topic as mentioned above. All abstracts will be subjected to review by the Technical Committee for their eventual inclusion in the conference proceedings.

The abstract submission portal is now open. Please click here to upload your abstract.
Deadline for submission of abstracts is 30th of November 2018.