The Electronics Manufacturing & Packaging Symposium (EMPS) will take place at ESA/ESTEC in Noordwijk, the Netherlands, from 6-9 October 2025.

The symposium is organised by the European Space Agency’s Materials, Manufacturing, and Assembly section and EEE Components Technologies section, in partnership with IPC, the global electronics association. The event will focus on the latest developments in printed circuit boards, electronic assembly and packaging technologies. While space applications remain a core focus, the event also covers high-reliability market segments such as defence, automotive, medical and data infrastructure, which are central to Europe’s electronics manufacturing industry.

Microprocessor chips and other EEE components do not function in isolation. Back-end packaging of chips as well as system level packaging, when assembling EEE parts on PCBs, make up the nerves and veins of the electronic system, connecting its brains – the chips – through signals and power. The packaging technologies provide the backbone and armour, as the sensitive EEE parts need protection from mechanical and thermal stress to operate reliably and in unison within the electronic system.

EMPS will host professional development and technology sessions covering a wide range of topics. For a full list, please visit the Topics section on the event website.