Topics
| Topics covered in the EMPS Symposium: |
- Materials & processes for electronics
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Assembly technologies, including lead-free, solderless,
press-fit
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Advanced packaging, including heterogeneous
integration, System-in Package, Wafer Level Packaging, 3D packaging
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(U)HDI PCBs, organic substrates
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Additive Manufactured Electronics
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Reliability and testing for harsh environments
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Model-based design for excellence
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Smart manufacturing, machine learning and
digitalisation
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High power, high speed applications and photonics
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System integration, packaging and performance
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Supply chain resilience, European sovereignty
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