The symposium is organised by the European Space Agency’s Materials, Manufacturing and Assembly section and EEE Components Technologies section, in partnership with the Global Electronics Association. It aims to review of the state-of-the-art and new developments in the fields of printed circuit boards, electronic assembly and packaging technologies. Besides space applications, the scope of the event is widened to include other high-rel market segments, such as defence, automotive, medical and data infrastructure, that are at the heart of Europe’s electronics manufacturing industry.

Microprocessor chips and other EEE components do not function in isolation. Back-end packaging of chips as well as system level packaging, when assembling EEE parts on PCBs, make up the nerves and veins of the electronic system, connecting its brains – the chips – through signals and power. The packaging technologies provide the backbone and armour, as the sensitive EEE parts need protection from mechanical and thermal stress to operate reliably and in unison within the electronic system.