Topics

Topics covered in the EMPS Symposium:

  • Materials & processes for electronics

  • Assembly technologies, including lead-free, solderless, press-fit

  • Advanced packaging, including heterogeneous integration, System-in Package, Wafer Level Packaging, 3D packaging

  • New developments and reliability performance of (U)HDI PCBs and IC organic substrates

  • Additive Manufactured Electronics

  • Reliability and testing for harsh environments

  • Model-based design for excellence

  • Smart manufacturing, machine learning and digitalisation

  • New concepts in components thermal management for high power, photonic and RF applications

  • Co-packaged optics and photonics applications

  • Transfer of non-hermetic modules packaging concepts from industrial and automotive to space applications
  • Supply chain resilience, European sovereignty



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